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d a t a sh eet preliminary speci?cation file under integrated circuits, ic01 1999 nov 11 integrated circuits UDA1334TS low power audio dac
1999 nov 11 2 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS contents 1 features 1.1 general 1.2 multiple format data interface 1.3 dac digital sound processing 1.4 advanced audio configuration 2 applications 3 general description 4 ordering information 5 quick reference data 6 block diagram 7 pinning 8 functional description 8.1 system clock 8.2 interpolation filter 8.3 noise shaper 8.4 filter stream dac 8.5 feature settings 8.5.1 digital interface format select 8.5.2 mute control 8.5.3 de-emphasis control 8.5.4 power control and sampling frequency select 9 limiting values 10 handling 11 thermal characteristics 12 quality specification 13 dc characteristics 14 ac characteristics 14.1 2.0 v supply voltage 14.2 3.0 v supply voltage 14.3 timing 15 application information 16 package outline 17 soldering 17.1 introduction to soldering surface mount packages 17.2 reflow soldering 17.3 wave soldering 17.4 manual soldering 17.5 suitability of surface mount ic packages for wave and reflow soldering methods 18 definitions 19 life support applications
1999 nov 11 3 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 1 features 1.1 general 1.8 to 3.6 v power supply voltage integrated digital filter plus dac supports sample frequencies from 8 to 100 khz automatic system clock versus sample rate detection low power consumption no analog post filtering required for dac slave mode only applications easy application ssop16 package. 1.2 multiple format data interface i 2 s-bus and lsb-justified format compatible 1f s input data rate. 1.3 dac digital sound processing digital de-emphasis for 44.1 khz sampling rate mute function. 1.4 advanced audio con?guration high linearity, wide dynamic range and low distortion standby or sleep mode in which the dac is powered down. 2 applications this audio dac is excellently suitable for digital audio portable application, such as portable md, mp3 and dvd players. 3 general description the UDA1334TS supports the i 2 s-bus data format with word lengths of up to 24 bits and the lsb-justified serial data format with word lengths of 16, 20 and 24 bits. the UDA1334TS has basic features such as de-emphasis (at 44.1 khz sampling rate) and mute. 4 ordering information type number package name description version UDA1334TS ssop16 plastic shrink small outline package; 16 leads; body width 4.4 mm sot369-1
1999 nov 11 4 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 5 quick reference data symbol parameter conditions min. typ. max. unit supplies v dda dac analog supply voltage 1.8 2.0 3.6 v v ddd digital supply voltage 1.8 2.0 3.6 v i dda dac analog supply current normal operation - 2.1 - ma sleep mode - 150 -m a i ddd digital supply current normal operation - 1.2 - ma sleep mode - 50 -m a t amb ambient temperature - 20 - +85 c digital-to-analog convertor (v dda =v ddd = 2.0 v) v o(rms) output voltage (rms value) at 0 db (fs) digital input; note 1 - 500 - mv (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s = 44.1 khz; at 0 db -- 80 - db f s = 44.1 khz; at - 60 db; a-weighted -- 37 - db f s = 96 khz; at 0 db -- 75 - db f s = 96 khz; at - 60 db; a-weighted -- 35 - db s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted - 97 - db f s = 96 khz; code = 0; a-weighted - 95 - db mute = high; a-weighted - 110 - db a cs channel separation - 100 - db digital-to-analog convertor (v dda =v ddd = 3.0 v) v o(rms) output voltage (rms value) at 0 db (fs) digital input; note 1 - 750 - mv (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s = 44.1 khz; at 0 db -- 90 - db f s = 44.1 khz; at - 60 db; a-weighted -- 40 - db f s = 96 khz; at 0 db -- 85 - db f s = 96 khz; at - 60 db; a-weighted -- 37 - db s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted - 100 - db f s = 96 khz; code = 0; a-weighted - 98 - db mute = high; a-weighted - 110 - db a cs channel separation - 100 - db
1999 nov 11 5 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS note 1. the dac output voltage scales proportional to the power supply voltage. 6 block diagram power dissipation (at f s = 44.1 khz) p power dissipation play-back mode; at 2.0 v supply voltage - 7.0 - mw play-back mode; at 3.0 v supply voltage - 17 - mw sleep mode - 0.5 - mw symbol parameter conditions min. typ. max. unit handbook, full pagewidth mgl877 dac UDA1334TS noise shaper interpolation filter de-emphasis 14 15 dac 6 digital interface 16 3 2 1 4 5 11 7 13 12 voutr bck v ssa ws voutl datai v dda v ddd v ref(dac) v ssd sfor0 sysclk 8 mute 9 deem 10 pcs sfor1 fig.1 block diagram.
1999 nov 11 6 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 7 pinning notes 1. 5 v tolerant is only supported if the power supply voltage is between 2.7 and 3.6 v. for lower power supply voltages this is maximum 3.3 v tolerant. 2. because of test issues these pads are not 5 v tolerant and they should be at power supply voltage level or at a maximum of 0.5 v above that level. symbol pin pad type description bck 1 5 v tolerant digital input pad; note 1 bit clock input ws 2 5 v tolerant digital input pad; note 1 word select input datai 3 5 v tolerant digital input pad; note 1 serial data input v ddd 4 digital supply pad digital supply voltage v ssd 5 digital ground pad digital ground sysclk 6 5 v tolerant digital input pad; note 1 system clock input sfor1 7 5 v tolerant digital input pad; note 1 serial format select 1 mute 8 5 v tolerant digital input pad; note 1 mute control deem 9 5 v tolerant digital input pad; note 1 de-emphasis control pcs 10 3-level input pad; note 2 power control and sampling frequency select sfor0 11 digital input pad; note 2 serial format select 0 v ref(dac) 12 analog pad dac reference voltage v dda 13 analog supply pad dac analog supply voltage voutl 14 analog output pad dac output left v ssa 15 analog ground pad dac analog ground voutr 16 analog output pad dac output right handbook, halfpage UDA1334TS mgl878 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 voutr bck v ssa ws voutl datai v dda v ddd v ref(dac) v ssd sfor0 sysclk pcs sfor1 deem mute fig.2 pin configuration.
1999 nov 11 7 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 8 functional description 8.1 system clock the UDA1334TS operates in slave mode only; this means that in all applications the system must provide the system clock and the digital audio interface signals (bck and ws). the system clock must be locked in frequency to the digital interface signals. the UDA1334TS automatically detects the ratio between the sysclk and ws frequencies. the bck clock can be up to 64f s , or in other words the bck frequency is 64 times the word select (ws) frequency or less: f bck 64 f ws . important : the ws edge must fall on the negative edge of the bck at all times for proper operation of the digital i/o data interface. the modes which are supported are given in table 1. table 1 supported sampling ranges notes 1. this mode can only be supported for power supply voltages down to 2.4 v. for lower voltages, in 192f s mode the sampling frequency should be limited to 55 khz. 2. not supported in low-sampling frequency mode. an example is given in table 2 for a 12.228 mhz system clock input. table 2 example using a 12.228 mhz system clock note 1. this mode can only be supported for power supply voltages down to 2.4 v. for lower voltages, in 192f s mode the sampling frequency should be limited to 55 khz. 8.2 interpolation ?lter the interpolation digital filter interpolates from 1f s to 64f s by cascading fir filters (see table 3). table 3 interpolation ?lter characteristics 8.3 noise shaper the 5th-order noise shaper operates at 64f s . it shifts in-band quantization noise to frequencies well above the audio band. this noise shaping technique enables high signal-to-noise ratios to be achieved. the noise shaper output is converted into an analog signal using an filter stream dac (fsdac). clock mode sampling range 768f s 8to55khz 512f s 8 to 100 khz 384f s 8 to 100 khz 256f s 8 to 100 khz 192f s 8 to 100 khz (1)(2) 128f s 8 to 100 khz (2) sampling frequency clock mode 96 khz 128f s 64 khz (1) 192f s 48 khz 256f s 32 khz 384f s 24 khz 512f s 16 khz 768f s item condition value (db) pass-band ripple 0 to 0.45f s 0.02 stop band >0.55f s - 50 dynamic range 0 to 0.45f s >114
1999 nov 11 8 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 8.4 filter stream dac the fsdac is a semi-digital reconstruction filter that converts the 1-bit data stream of the noise shaper to an analog output voltage. the filter coefficients are implemented as current sources and are summed at virtual ground of the output operational amplifier. in this way very high signal-to-noise performance and low clock jitter sensitivity is achieved. no post-filter is needed due to the inherent filter function of the dac. on-board amplifiers convert the fsdac output current to an output voltage signal capable of driving a line output. the output voltage of the fsdac scales proportional with the power supply voltage. 8.5 feature settings the features of the UDA1334TS can be set by control pins sfor1, sfor0, mute, deem and pcs. 8.5.1 d igital interface format select the digital audio interface formats (see fig.3) can be selected via the pins sfor1 and sfor0 as shown in table 4. the bck frequency for the digital audio interface can be maximum 64 times the ws frequency: f bck 64f ws . table 4 data format selection 8.5.2 m ute control the output signal can be soft muted by setting pin mute to high level as shown in table 5. table 5 mute control when the output signal is fully muted (pin mute at high level), a silence switch inside the fsdac is activated. in this way a very high signal-to-noise ratio can be achieved in case the output is muted. 8.5.3 d e - emphasis control de-emphasis can be switched on for f s = 44.1 khz by setting pin deem at high level. the function description of pin deem is given in table 6. table 6 de-emphasis control 8.5.4 p ower control and sampling frequency select pin pcs is a 3-level pin and is used to set the mode of the UDA1334TS. the definition is given in table 7. table 7 pcs function de?nition the low sampling frequency mode is required to have a higher oversampling rate in the noise shaper in order to improve the signal-to-noise ratio. in this mode the oversampling ratio of the noise shaper will be 128f s instead of 64f s . sfor1 sfor0 input format low low i 2 s-bus input low high lsb-justi?ed 16 bits input high low lsb-justi?ed 20 bits input high high lsb-justi?ed 24 bits input mute function low mute off high mute on deem function low de-emphasis off high de-emphasis on pcs function low normal operating mode mid low sampling frequency mode high power-down or sleep mode
1999 nov 11 9 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... handbook, full pagewidth mgs752 16 b5 b6 b7 b8 b9 b10 left lsb-justified format 24 bits ws bck data right 15 18 17 20 19 22 21 23 24 2 1 b3 b4 msb b2 b23 lsb 16 b5 b6 b7 b8 b9 b10 15 18 17 20 19 22 21 23 24 21 b3 b4 msb b2 b23 lsb 16 msb b2 b3 b4 b5 b6 left lsb-justified format 20 bits ws bck data right 15 18 17 20 19 2 1 b19 lsb 16 msb b2 b3 b4 b5 b6 15 18 17 20 19 2 1 b19 lsb 16 msb b2 left lsb-justified format 16 bits ws bck data right 15 2 1 b15 lsb 16 msb b2 15 2 1 b15 lsb msb msb b2 2 1 > = 8 12 3 left i 2 s-bus format ws bck data right 3 > = 8 msb b2 fig.3 digital audio formats.
1999 nov 11 10 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 9 limiting values in accordance with the absolute maximum rating system (iec 134). note 1. all supply connections must be made to the same power supply. 10 handling inputs and outputs are protected against electrostatic discharge in normal handling. however, it is good practice to take normal precautions appropriate to handling mos devices. 11 thermal characteristics 12 quality specification in accordance with snw-fq-611-e . 13 dc characteristics v ddd =v dda = 2.0 v; t amb =25 c; r l =5k w . all voltages with respect to ground (pins v ssa and v ssd ); unless otherwise speci?ed. symbol parameter conditions min. max. unit v dd supply voltage note 1 - 4.0 v t xtal(max) maximum crystal temperature - 150 c t stg storage temperature - 65 +125 c t amb ambient temperature - 20 +85 c v es electrostatic handling voltage human body model - 2000 +2000 v machine model - 200 +200 v symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air 145 k/w symbol parameter conditions min. typ. max. unit supplies v dda dac analog supply voltage note 1 1.8 2.0 3.6 v v ddd digital supply voltage note 1 1.8 2.0 3.6 v i dda dac analog supply current normal operating mode; at 2.0 v supply voltage - 2.1 - ma normal operating mode; at 3.0 v supply voltage - 3.3 - ma sleep mode - 150 -m a i ddd digital supply current normal operating mode; at 2.0 v supply voltage - 1.2 - ma normal operating mode; at 3.0 v supply voltage - 2.1 - ma sleep mode - 50 -m a
1999 nov 11 11 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS notes 1. all supply connections must be made to the same external power supply unit. 2. at 3 v supply voltage, the input pads are ttl compatible. however, at 2.0 v supply voltage no ttl levels can be accepted, but levels from 3.3 v domain can be applied to the pins. 3. when the dac drives a capacitive load above 50 pf, a series resistance of 100 w must be used to prevent oscillations in the output operational amplifier. 14 ac characteristics 14.1 2.0 v supply voltage v ddd =v dda = 2.0 v; f i = 1 khz; t amb =25 c; r l =5k w . all voltages with respect to ground (pins v ssa and v ssd ); unless otherwise speci?ed. digital input pins; note 2 v ih high-level input voltage at 2.0 v supply voltage 1.3 - 3.3 v at 3.0 v supply voltage 2.0 - 5.0 v v il low-level input voltage at 2.0 v supply voltage - 0.5 - +0.5 v at 3.0 v supply voltage - 0.5 - +0.8 v ? i li ? input leakage current -- 1 m a c i input capacitance -- 10 pf 3-level input: pin pcs v ih high-level input voltage 0.9v ddd - v ddd v v im mid-level input voltage 0.4v ddd - 0.6v ddd v v il low-level input voltage 0 - 0.5 v dac v ref(dac) reference voltage with respect to v ssa 0.45v dd 0.5v dd 0.55v dd v r o(ref) v ref(dac) reference output resistance - 12.5 - k w i o(max) maximum output current (thd + n)/s < 0.1%; r l = 800 w - tbf - ma r l load resistance 3 -- k w c l load capacitance note 3 -- 50 pf symbol parameter conditions min. typ. max. unit dac v o(rms) output voltage (rms value) at 0 db (fs) digital input - 0.5 - v d v o unbalance between channels - 0.1 - db (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s = 44.1 khz; at 0 db -- 80 - db f s = 44.1 khz; at - 60 db; a-weighted -- 37 - db f s = 96 khz; at 0 db -- 75 - db f s = 96 khz; at - 60 db; a-weighted -- 35 - db symbol parameter conditions min. typ. max. unit
1999 nov 11 12 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 14.2 3.0 v supply voltage v ddd =v dda = 3.0 v; f i = 1 khz; t amb =25 c; r l =5k w . all voltages with respect to ground (pins v ssa and v ssd ); unless otherwise speci?ed. 14.3 timing v ddd =v dda = 1.8 to 3.6 v; t amb = - 20 to +85 c; r l =5k w . the typical timing is speci?ed at f s = 44.1 khz (sampling frequency). all voltages with respect to ground (pins v ssa and v ssd ); unless otherwise speci?ed. s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted - 97 - db f s = 96 khz; code = 0; a-weighted - 95 - db mute = high; a-weighted - 110 - db a cs channel separation - 100 - db psrr power supply rejection ratio f ripple = 1 khz; v ripple = 30 mv (p-p) - 60 - db symbol parameter conditions min. typ. max. unit dac v o(rms) output voltage (rms value) at 0 db (fs) digital input - 0.75 - v d v o unbalance between channels - 0.1 - db (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s = 44.1 khz; at 0 db -- 90 - db f s = 44.1 khz; at - 60 db; a-weighted -- 40 - db f s = 96 khz; at 0 db -- 85 - db f s = 96 khz; at - 60 db; a-weighted -- 37 - db s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted - 100 - db f s = 96 khz; code = 0; a-weighted - 98 - db mute = high; a-weighted - 110 - db a cs channel separation - 100 - db psrr power supply rejection ratio f ripple = 1 khz; v ripple = 30 mv (p-p) - 60 - db symbol parameter conditions min. typ. max. unit system clock timing (see fig.4) t sys system clock cycle time f sys = 256f s 35 88 780 ns f sys = 384f s 23 59 520 ns f sys = 512f s 17 44 390 ns t cwh system clock high time f sys < 19.2 mhz 0.3t sys - 0.7t sys ns f sys 3 19.2 mhz 0.4t sys - 0.6t sys ns t cwl system clock low time f sys < 19.2 mhz 0.3t sys - 0.7t sys ns f sys 3 19.2 mhz 0.4t sys - 0.6t sys ns symbol parameter conditions min. typ. max. unit
1999 nov 11 13 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS serial interface timing (see fig.5) f bck bit clock frequency -- 64f s hz t bckh bit clock high time 50 -- ns t bckl bit clock low time 50 -- ns t r rise time -- 20 ns t f fall time -- 20 ns t su(datai) set-up time data input 20 -- ns t h(datai) hold time data input 0 -- ns t su(ws) set-up time word select 20 -- ns t h(ws) hold time word select 10 -- ns symbol parameter conditions min. typ. max. unit handbook, full pagewidth mgr984 t sys t cwh t cwl fig.4 system clock timing. handbook, full pagewidth mgl880 t f t h(ws) t su(ws) t su(datai) t h(datai) t bckh t bckl t cy(bck) t r ws bck datai fig.5 serial interface timing.
1999 nov 11 14 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 15 application information handbook, full pagewidth mgl879 47 w r5 UDA1334TS 6 sysclk system clock 1 bck 2 ws 3 datai 14 voutl r3 100 w r1 220 k w 16 voutr r4 100 w r2 220 k w 7 sfor1 11 sfor0 9 deem 10 pcs 8 mute 47 m f (16 v) c4 47 m f (16 v) c3 left output right output 12 v ref(dac) c7 47 m f (16 v) c8 100 nf (63 v) 4 5 v ddd v ssd r6 1 w digital supply voltage c6 15 13 v ssa v dda r7 1 w c9 47 m f (16 v) c10 100 nf (63 v) 100 nf (63 v) analog supply voltage c5 47 m f (16 v) c1 10 nf (63 v) 10 nf (63 v) c2 fig.6 typical application diagram.
1999 nov 11 15 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 16 package outline unit a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.15 0.00 1.4 1.2 0.32 0.20 0.25 0.13 5.30 5.10 4.5 4.3 0.65 6.6 6.2 0.65 0.45 0.48 0.18 10 0 o o 0.13 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.20 mm maximum per side are not included. 0.75 0.45 1.0 sot369-1 94-04-20 95-02-04 w m q a a 1 a 2 b p d y h e l p q detail x e z e c l v m a x (a ) 3 a 0.25 18 16 9 pin 1 index 0 2.5 5 mm scale ssop16: plastic shrink small outline package; 16 leads; body width 4.4 mm sot369-1 a max. 1.5
1999 nov 11 16 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 17 soldering 17.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. 17.2 re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. 17.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.4 manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
1999 nov 11 17 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS 17.5 suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 18 definitions 19 life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. package soldering method wave reflow (1) bga, lfbga, sqfp, tfbga not suitable suitable hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1999 nov 11 18 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS notes
1999 nov 11 19 philips semiconductors preliminary speci?cation low power audio dac UDA1334TS notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 1999 68 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 printed in the netherlands 545002/25/01/pp 20 date of release: 1999 nov 11 document order number: 9397 750 06399

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